Multilayer suspension, head gimbal assembly and manufacturing method of head gimbal assembly

ABSTRACT

A multilayer suspension includes a resilient bending section formed by partially removing at least part of layers of a five-layer structure which includes a first metal thin plate layer, a first resin layer laminated on the first metal thin-plate layer, a second metal thin-plate layer laminated on the first resin layer, a second resin layer laminated on the second metal thin-plate layer, and a conductive layer laminated on the second resin layer, a resilient gimbal section for mounting a head slider, formed by partially removing at least part of layers of the five-layer structure, and a rigid section for coupling the bending section and the gimbal section, formed by partially removing at least part of layers of the five-layer structure. An HGA includes thus formed multilayer suspension and a head slider mounted on the multilayer suspension and provided with at least one head element.

FIELD OF THE INVENTION

[0001] The present invention relates to a multilayer suspension forsupporting a flying head slider provided with a magnetic thin-film headelement or an optical head element, to a head gimbal assembly (HGA)provided with the multilayer suspension, and to a manufacturing methodof the HGA.

DESCRIPTION OF THE RELATED ART

[0002] In a magnetic hard disk drive (HDD) unit, magnetic write headelements for writing magnetic information onto magnetic hard disks andmagnetic read head elements for reading magnetic information from themagnetic hard disks are in general formed on magnetic head slidersflying in operation above the rotating magnetic disks. The sliders aresupported at top end sections of suspensions of HGAs, respectively.

[0003] Recent ever-increasing demands for downsizing of the HDD unit andfor increasing of data storage capacities and densities in the HDD unitadvance further miniaturization and weight reduction of the magnetichead slider and further increasing rotational speed of the magnetic harddisk.

[0004] A suspension for supporting such miniaturized and light-weightedmagnetic head slider needs not only to precisely control a load appliedto the magnetic head slider by properly adjusting its stiffness or rateof spring but also to more improve its windage-resistance performanceand its vibration performance.

[0005] The windage of the suspension caused by the side wind produced byhigh-speed rotation of the magnetic hard disk will greatly influence theattitude of the flying magnetic head slider. In order to decrease thewindage, it is necessary to make the thickness of the suspension as thinas possible. However, if the thickness is too thin, since the rigidityof the suspension itself will fall, its vibration performancedeteriorates.

[0006] There are two kinds of suspension provided with a possibility ofsolving these mutually contradictory problems.

[0007] One is a partial etching suspension. A load beam of this partialetching suspension is made from a relatively thick stainless steel platewith a thickness of 100 μm for example. Only a bending section or loadadjusting section of the load beam is half-etched to reduce itsstiffness. Thus, no excess load will be induced at the top end sectionof the load beam even if the bending section is bent to a considerableextent, and also the rigidity of the remaining section of the load beamcan be ensured. This suspension is completed by fixing an independentflexure provided with lead conductors to thus configured load beam bylaser welding.

[0008] The other one is a multipart suspension. A load beam of thismultipart suspension is made from a relatively thick stainless steelplate to improve the windage-resistance performance and the vibrationperformance. The load beam and a base plate are coupled by a resilienthinge made from a relatively thin stainless steel plate. The hingeconfigures a bending section or load adjusting section of the load beamto adjust the stiffness. Fixing of the hinge with the load beam and thebase plate is executed by laser welding. Then, the suspension iscompleted by fixing an independent flexure provided with lead conductorsto the load beam by laser welding.

[0009] These partial etching suspension and multipart suspension havehowever following problems.

[0010] The partial etching suspension is fabricated by etching a part ofthe load beam to a desired depth so as to adjust its stiffness. Sincethe stiffness changes depending upon the remaining thickness of theetched part, if the etching condition varies, the obtained stiffnesswill change accordingly. Therefore, it is quite difficult to alwaysfabricate the suspension with an optimum constant stiffness. Whenfabricating this partial etching suspension, it is necessary to assemblethe independent flexure with the load beam by laser welding. Thus, thelaser welding process is additionally needed. Also, since the alignmentof the flexure with respect to the load beam is difficult to executewith high accuracy, a high precision suspension cannot be expected.

[0011] The multipart suspension can be always fabricated to have anoptimum stiffness because the hinge determines its stiffness. However,additional laser welding processes for fixing the hinge to the baseplate, for fixing the load beam to the hinge and for fixing the flexureto the load beam are needed. Also, since the alignments of theindependent components such as the flexure, load beam, hinge and baseplate are difficult to execute with high accuracy, a high precisionsuspension cannot be expected.

SUMMARY OF THE INVENTION

[0012] It is therefore an object of the present invention to provide amultilayer suspension, an HGA provided with the multilayer suspension,and a manufacturing method of the HGA, whereby the number of laserwelding processes during fabrication of the suspension can be greatlyreduced and the precision of the suspension can be extremely improved.

[0013] Another object of the present invention is to provide amultilayer suspension, an HGA provided with the multilayer suspension,and a manufacturing method of the HGA, whereby a windage-resistanceperformance and a vibration performance of the suspension can beimproved while optimally keeping its stiffness or rate of spring.

[0014] According to the present invention, a multilayer suspensionincludes a resilient bending section formed by partially removing atleast part of layers of a five-layer structure which includes a firstmetal thin-plate layer, a first resin layer laminated on the first metalthin-plate layer, a second metal thin-plate layer laminated on the firstresin layer, a second resin layer laminated on the second metalthin-plate layer, and a conductive layer laminated on the second resinlayer, a resilient gimbal section for mounting a head slider, formed bypartially removing at least part of layers of the five-layer structure,and a rigid section for coupling the bending section and the gimbalsection, formed by partially removing at least part of layers of thefive-layer structure.

[0015] Also, according to the present invention an HGA includes thusformed multilayer suspension and a head slider mounted on the multilayersuspension and provided with at least one head element.

[0016] Since the multilayer suspension is fabricated by partiallyremoving at least part of layers of the five-layer structure withoutassembling individually separated parts, the number of mechanicalconnections or couplings of parts can be minimized. Therefore, thenumber of laser welding processes during fabrication of the suspensionand the HGA can be greatly reduced and the precision of the suspensionand the HGA can be extremely improved. Also, since it is possible toensure the rigidity, a vibration performance of the suspension and theHGA can be improved. Furthermore, since the thickness can be reduced, awindage-resistance performance of the suspension and the HGA can be alsoimproved. Of course, it is possible to precisely control the stiffnessof the suspension.

[0017] It is preferred that, in the bending section, at least the firstmetal thin-plate layer is selectively removed. Since the first metalthin-plate layer is fully removed, stiffness in this section can beprecisely reduced to a desired value.

[0018] It is also preferred that, in the bending section, the firstmetal thin-plate layer and the first resin layer are selectivelyremoved. Because the first resin layer is additionally and fullyremoved, the stiffness in this section can be further reduced.

[0019] It is preferred that, in the bending section, at least one viahole is formed. By forming the via hole or holes, the stiffness can bedelicately adjusted and the weight of the suspension and the HGA can bereduced.

[0020] It is also preferred that, in the rigid section, at least, thefirst metal thin-plate layer, the first resin layer and the second metalthin-plate layer are remained. Since the two metal layers and the resinlayer between them are remained, sufficient rigidity can be ensured.

[0021] Preferably, in the rigid section, at least one via hole is formedto reduce the weight of the suspension and the HGA.

[0022] It is preferred that, in the gimbal section, the first metalthin-plate layer and the first resin layer are selectively removed.Thus, the stiffness in this section can be greatly and preciselyreduced.

[0023] It is preferred that, in the gimbal section, a gimbal via hole isformed in its center. In this case, preferably, the first metalthin-plate layer has a dimple passing through the gimbal via hole, fordirectly depressing a rear surface of the head slider to be mounted onthe gimbal section.

[0024] It is further preferred that the conductive layer consists ofpatterned trace conductors and patterned connection pads. Since thetrace conductors and the connection pads and also the insulation layeror the second resin layer under them are patterned from the single piecelayers, no retrofitting process is necessary and no misalignment willoccur. As a result, a high precision suspension can be expected.

[0025] It is preferred that the first and second metal thin-plate layersare formed by stainless steel thin plates, that the first and secondresin layers are formed by polyimide resin layers, and/or that theconductive layer is formed by a copper layer.

[0026] According to the present invention, furthermore, a manufacturingmethod of an HGA includes a step of preparing a five-layer sheet whichincludes a first metal thin-plate layer, a first resin layer laminatedon the first metal thin-plate layer, a second metal thin-plate layerlaminated on the first resin layer, a second resin layer laminated onthe second metal thin-plate layer, and a conductive layer laminated onthe second resin layer, a step of forming a multilayer suspension bypartially removing at least part of layers of the five-layer sheet, themultilayer suspension including a resilient bending section, a resilientgimbal section for mounting a head slider and a rigid section forcoupling the bending section and the gimbal section, and a step offixing the head slider having at least one head element on the gimbalsection of the multilayer suspension.

[0027] Since an HGA is assembled using a multilayer suspension bodyfabricated by partially removing at least part of layers of thefive-layer structure without assembling individually separated parts,the number of mechanical connections or couplings of parts can beminimized. Therefore, the number of laser welding processes duringfabrication of the suspension and the HGA can be greatly reduced and theprecision of the suspension and the HGA can be extremely improved. Also,since it is possible to ensure the rigidity, a vibration performance ofthe suspension and the HGA can be improved. Furthermore, since thethickness can be reduced, a windage-resistance performance of thesuspension and the HGA can be also improved. Of course, it is possibleto precisely control the stiffness of the suspension.

[0028] It is preferred that the forming step includes selectivelyetching and removing, in the bending section, at least the first metalthin-plate layer. Since the first metal thin-plate layer is fullyremoved by selective etching, stiffness in this section can be preciselyreduced to a desired value.

[0029] It is also preferred that the forming step includes selectivelyetching and removing, in the bending section, the first metal thin-platelayer and the first resin layer, respectively. Because the first resinlayer is additionally and fully removed by selective etching, thestiffness in this section can be further reduced.

[0030] It is further preferred that the forming step includes forming,in the bending section, at least one via hole by etching. By forming thevia hole or holes, the stiffness can be delicately adjusted and theweight of the suspension and the HGA can be reduced.

[0031] It is preferred that the forming step includes remaining, in therigid section, at least, the first metal thin-plate layer, the firstresin layer and the second metal thin-plate layer. Since the two metallayers and the resin layer between them are remained, sufficientrigidity can be ensured.

[0032] In this case, it is preferred that, in the rigid section, thefirst resin layer has a thickness to form a damper structure.

[0033] It is also preferred that the forming step includes forming, inthe rigid section, at least one via hole by etching to reduce the weightof the suspension and the HGA.

[0034] It is further preferred that the forming step includesselectively etching and removing, in the gimbal section, the first metalthin-plate layer and the first resin layer, respectively. Thus, thestiffness in this section can be greatly and precisely reduced.

[0035] It is preferred that the forming step includes forming, in thegimbal section, a gimbal via hole in the center by etching. In thiscase, preferably, the forming step includes forming a dimple passingthrough the gimbal via hole, for directly depressing a rear surface ofthe head slider by stamping the first metal thin-plate layer.

[0036] It is also preferred that the forming step includes forming traceconductors and connection pads by patterning the conductive layer. Sincethe trace conductors and the connection pads and also the insulationlayer or the second resin layer under them are patterned from the singlepiece layers, no retrofitting process is necessary and no misalignmentwill occur. As a result, a high precision suspension can be expected.

[0037] It is preferred that the first and second metal thin-plate layersare formed by stainless steel thin plates, that the first and secondresin layers are formed by polyimide resin layers, and/or that theconductive layer is formed by a copper layer.

[0038] It is also preferred that the forming step includes forming amultilayer suspension by partially removing at least part of layers ofthe five-layer sheet by selective etching.

[0039] Further objects and advantages of the present invention will beapparent from the following description of the preferred embodiments ofthe invention as illustrated in the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0040]FIG. 1 shows a center line sectional view schematicallyillustrating the whole of an HGA as a preferred embodiment according tothe present invention;

[0041]FIG. 2 shows an enlarged oblique view illustrating a top endsection of the HGA shown in FIG. 1;

[0042]FIG. 3a to 3 f show a center line sectional view illustratingmanufacturing processes of a suspension in the embodiment shown in FIG.1;

[0043]FIG. 4 shows a center line sectional view schematicallyillustrating the whole of an HGA as an modification of the embodimentshown in FIG. 1;

[0044]FIG. 5 shows a center line sectional view schematicallyillustrating the whole of an HGA as another modification of theembodiment shown in FIG. 1; and

[0045]FIG. 6 shows a center line sectional view schematicallyillustrating the whole of an HGA as another embodiment according to thepresent invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0046]FIG. 1 schematically illustrates the whole of an HGA as apreferred embodiment according to the present invention, and FIG. 2illustrates a top end section of this HGA shown in FIG. 1.

[0047] As shown in these figures, the HGA in this embodiment has afive-layer suspension body 10, a base plate 11 fixed to a base endsection of the suspension body 10, and a flying magnetic head slider 13provided with a thin-film magnetic head element 12, fixed to a top endsection of the suspension body 10.

[0048] Terminal electrodes of the thin-film magnetic head element 12 areelectrically and mechanically connected to head connection pads 14formed on the suspension body 10 by ball bonding using for example Auballs or solder balls, respectively.

[0049] The suspension body 10 has a five-layer structure formed in asingle piece by sequentially laminating a first stainless steel thinplate 10 a with a relatively large thickness (larger thickness than thatof a second stainless steel thin plate 10 c), a first resin layer 10 b,a second stainless steel thin plate 10 c with a relatively smallthickness (smaller thickness than that of the first stainless steel thinplate 10 a), a second resin layer 10 d and a copper layer 10 e patternedas trace conductors and connection pads. In this embodiment, the firststainless steel thin plate 10 a is made of for example SUS304TA with athickness of about 60 μm. The first resin layer 10 b is made ofpolyimide with a thickness of about 10 μm. The second stainless steelthin plate 10 c is made of for example SUS304TA with a thickness ofabout 20-25 μm which is thinner than that of the first stainless steelthin plate 10 a. The second resin layer 10 d is made of polyimide with athickness of about 10 μm. The copper layer 10 e is made of copper with athickness of about 10 μm.

[0050] This suspension body 10 is sectioned into a base section A fixedto the base plate 11, a resilient bending section B continuouslyfollowing to the base section A, a resilient gimbal section C on whichthe magnetic head slider 13 is mounted, and a rigid section Dcontinuously following to the bending section B and to the gimbalsection C, for coupling these sections B and C. Each of these sectionsA-D are formed by partially and selectively etching at least one layerof the five-layer structure.

[0051] In the bending section B, according to this embodiment, all ofthe first stainless steel thin plate 10 b is etched and removed toreduce stiffness in this section to a desired value. The first resinlayer 10 b and the second stainless steel thin plate 10 c are remainedas they are and the second resin layer 10 d and the copper layer 10 eare patterned and remained.

[0052] As shown in FIG. 4, in a modification of this embodiment, one ora plurality of via holes 19 may be formed in this bending section B. Byforming the via hole or holes 19, the stiffness can be more preciselyadjusted and the weight of the whole suspension can be reduced. Theother configurations, operations and advantages in this modification arethe same as those of the embodiment of FIG. 1.

[0053] According to the embodiment of FIG. 1, the first stainless steelthin plate 10 a, the first resin layer 10 b and the second stainlesssteel thin plate 10 c are remained as they are in the base section A andthe rigid section D. Thus, a desired rigidity can be ensured resulting adeformation of these sections to prevent. In addition, since the sideedges of the rigid section D are not bent but formed in flat,air-resistance against the side wind can be reduced to improve thewindage-resistance performance. In these sections A and D, the secondresin layer 10 d and the copper layer 10 e are patterned and remained.

[0054] As shown in FIG. 5, in another modification of this embodiment,one or a plurality of via holes 20 may be formed in the rigid section D.By forming the via hole or holes 20, the weight of the whole suspensioncan be reduced. The other configurations, operations and advantages inthis modification are the same as those of the embodiment of FIG. 1.

[0055] According to the embodiment of FIG. 1, the gimbal section C issubstantially configured by the second stainless steel thin plate 10 c.Therefore, the stiffness in this gimbal section C is reduced to have adesired resilience for mounting the magnetic head slider 13. Namely, inthe gimbal section C, a flexible tongue 15 having elasticity forflexibly supporting the magnetic head slider 13 to provide a freeattitude is formed. Mounting of the magnetic head slider 13 on thesuspension is performed by adhering it to the flexible tongue 15 and bybonding the terminal electrodes of the thin-film magnetic head element12 to the head connection pads 14.

[0056] A via hole 16 into which a free end of the magnetic head slider13 is capable of getting is opened at the center of this gimbal sectionC. One end section of the first stainless steel thin plate 10 a, whichhas a projection or dimple 17, extends to the via hole 16 so that thedimple 17 passing through the via hole 16 directly depresses a rearsurface of the magnetic head slider 13. In the section C, the secondresin layer 10 d and the copper layer 10 e are patterned and remained.

[0057] Over all the sections A to D, the copper layer 10 e is patternedto form trace conductors 18, the head connection pads 14 and externalconnection pads (not shown) and the second resin layer 10 d is patternedto form an insulation layer 19 located under the patterned copper layer10 e.

[0058] The base plate 11 is made of in this embodiment a stainless steelor iron plate with a thickness of about 300 μm and fixed to the basesection A of the suspension body 10 by laser welding. The HGA isattached to a drive arm (not shown) by fixing the base plate 11 at itsattaching hole 11 a.

[0059] Fixing of the magnetic head slider 13 to the suspension body 10may be performed only by bonding of its terminal electrodes to the headconnection pads 14 without using adhesive.

[0060]FIG. 3a to 3 f illustrate manufacturing processes of thesuspension in this embodiment. Hereinafter, with reference to thesefigures, a manufacturing method of the suspension will be described indetail. In order to simplify explanations, only a single suspension isexpressed in these figures. However, actually, many suspensions areformed on the same multilayer sheet, and are separated into individualpieces thereafter.

[0061] First, as shown in FIG. 3a, a five-layer sheet 30 formed in asingle piece by sequentially laminating a first stainless steel thinplate 30 a, a first polyimide layer 30 b, a second stainless steel thinplate 30 c, a second polyimide layer 30 d and a copper layer 30 e isprepared. Such five-layer sheet may be fabricated by inserting adhesivepolyimide sheets between the first and second stainless steel thinplates and between the second stainless steel thin plate and a copperthin plate or copper foil for the copper layer, respectively, and thenby pressing under heating these laminated five sheets so as to beintegrated. Alternately, the five-layer sheet may be fabricated bycoating liquid state polyimide on one surfaces of the first and secondstainless steel thin plates, on the other surface of the secondstainless steel thin plate and on one surface of the copper thin plate,and then by laminating and pressing these plates under half cured stateof the polyimide so as to be integrated. However, the fabrication methodof the five-layer sheet 30 is not limited to these methods but anyfabrication method can be used. For example, the copper layer 30 e maybe formed by sputtering or by plating in stead of using the copper thinplate.

[0062] In this embodiment, the first stainless steel thin plate 30 a isformed to have a thickness of about 60 μm, the first polyimide layer 30b about 10 μm, the second stainless steel thin plate 30 c about 20-25μm, the second polyimide layer 30 d about 10 μm and the copper layer 30e about 10 μm.

[0063] Then, as shown in FIG. 3b, the trace conductors 18, the headconnection pads 14 and the external connection pads are formed bypatterning the copper layer 30 e. This patterning of the copper layer 30e is performed by etching the five-layer sheet 30 from its one surfaceor from its bottom surface in the figure.

[0064] In order to etch the copper layer 30 e, acid such as FeCl₃(ferric chloride) or (NH₄)₂S (ammonium sulfide) may be used. Such acidwill selectively etch copper only, but never acts on polyimide.Therefore, the second polyimide layer 30 d operates as an etching stoplayer and all the thickness of the copper layer 30 e within the regionsto be etched is completely etched or removed. In other words, the etcheddepth of the copper layer 30 e can be certainly kept constant.

[0065] Then, as shown in FIG. 3c, all the thickness of the secondpolyimide layer 30 d within partial regions is selectively removed byetching the five-layer sheet 30 from its bottom surface in the figure.By removing the partial regions, at least area of the second polyimidelayer 30 d for working as an insulation layer of the trace conductors18, the head connection pads 14 and the external connection pads willremain.

[0066] In order to etch the polyimide layer 30 d, a wet etching usingalkali such as KOH (potassium hydroxide) or a dry etching using O₂plasma or CF₄ plasma may be executed. Such etching will selectively etchpolyimide only, but never acts on stainless steel. Therefore, the secondstainless steel thin plate 30 c operates as an etching stop layer andall the thickness of the second polyimide layer 30 d within the regionsto be etched is completely etched or removed. In other words, the etcheddepth of the polyimide layer 30 d can be certainly kept constant.

[0067] Then, as shown in FIG. 3d, all the thickness of the firststainless steel thin plate 30 a within partial regions and all thethickness of the second stainless steel thin plate 30 c within partialregions are selectively and simultaneously removed by etching thefive-layer sheet 30 from its both surfaces or from its top and bottomsurfaces in the figure. The partial regions of the first stainless steelthin plate 30 a correspond to in the concrete a region for the attachinghole 11 a of the base plate in the base section A, and to top endsections of the bending section B and the gimbal section C. The partialregions of the second stainless steel thin plate 30 d correspond to inthe concrete the region for the attaching hole 11 a of the base plate inthe base section A and to the via hole 16 in the gimbal section C.

[0068] In order to etch the stainless steel thin plates 30 a and 30 c,acid such as FeCl₃ (ferric chloride) may be used. Such acid willselectively etch stainless steel plates only, but never acts onpolyimide. Therefore, the first polyimide layer 30 b operates as anetching stop layer and all the thickness of the first and secondstainless steel thin plates 30 a and 30 c within the regions to beetched is completely etched or removed even though having differentthicknesses. In other words, the etched depth of the stainless steelplates 30 a and 30 c can be certainly kept constant.

[0069] Then, as shown in FIG. 3e, all the thickness of the firstpolyimide layer 30 b within partial regions is selectively removed byetching the five-layer sheet 30 from its both surfaces or from its topand bottom surfaces in the figure. The partial regions of the polyimidelayer 30 b correspond to in the concrete a region for the attaching hole11 a of the base plate in the base section A, and to the top end sectionof the gimbal section C.

[0070] Similar to the aforementioned process shown in FIG. 3c, aselective wet etching using alkali such as KOH (potassium hydroxide) ora selective dry etching using O₂ plasma or CF₄ plasma may be executed.In this case, the first and second stainless steel thin plates 30 a and30 c operate as etching stop layers.

[0071] Then, as shown in FIG. 3f, the dimple 17 is formed in the gimbalsection C of the first stainless steel thin plate 30 a by stamping theplate 30 a from the upper surface of the five-layer sheet 30 in thefigure.

[0072] Thereafter, by fixing the base plate 11 to the suspension body,by fixing the magnetic head slider 13 to the suspension body, by bondingits terminal electrodes to the head connection pads 14, by mechanicallybending the bending section B, and then by separating into theindividual pieces, the HGA shown in FIG. 1 is completed.

[0073] As aforementioned, according to this embodiment and itsmodifications, since the suspension body is fabricated by partiallyetching and removing a part of layers of the five-layer sheet withoutassembling individually separated parts, the number of mechanicalconnections or couplings of parts can be minimized. Therefore, thenumber of laser welding processes during fabrication of the suspensionand the HGA can be greatly reduced and the precision of the suspensionand the HGA can be extremely improved. Also, since it is possible toensure the rigidity, a vibration performance of the suspension and theHGA can be improved. Furthermore, since the thickness can be reduced, awindage-resistance performance of the suspension and the HGA can be alsoimproved.

[0074] Moreover, since all the thickness within desired regions of eachlayer can be completely removed by the selective etching, it is possibleto precisely control the stiffness of the suspension.

[0075] Furthermore, since the trace conductors and the connection padsand the insulation layer or the second polyimide layer under them arepatterned from the single piece layers, no retrofitting process isnecessary and no misalignment will occur. As a result, a high precisionsuspension can be expected.

[0076] Also, adopting suitable polyimide thickness as the resin layer 10b, it is possible to create a damper structure with the stainless steelthin plate 10 a.

[0077]FIG. 6 schematically illustrates the whole of an HGA as anotherembodiment according to the present invention.

[0078] In this embodiment, both the first stainless steel thin plate 10a and the first resin layer 10 b are completely removed in the bendingsection B to more reduce the stiffness in this section B. The otherconfigurations, operations and advantages in this embodiment are thesame as those of the embodiment of FIG. 1. Thus, in this embodiment ofFIG. 6, the same references are used for the similar components as thosein the embodiment of FIG. 1.

[0079] Many widely different embodiments of the present invention may beconstructed without departing from the spirit and scope of the presentinvention. It should be understood that the present invention is notlimited to the specific embodiments described in the specification,except as defined in the appended claims.

What is claimed is:
 1. A multilayer suspension comprising: a resilientbending section formed by partially removing at least part of layers ofa five-layer structure which includes a first metal thin-plate layer, afirst resin layer laminated on said first metal thin-plate layer, asecond metal thin-plate layer laminated on said first resin layer, asecond resin layer laminated on said second metal thin-plate layer, anda conductive layer laminated on said second resin layer; a resilientgimbal section for mounting a head slider, formed by partially removingat least part of layers of said five-layer structure; and a rigidsection for coupling said bending section and said gimbal section,formed by partially removing at least part of layers of said five-layerstructure.
 2. The multilayer suspension as claimed in claim 1, wherein,in said bending section, at least said first metal thin-plate layer isselectively removed.
 3. The multilayer suspension as claimed in claim 1,wherein, in said bending section, said first metal thin-plate layer andsaid first resin layer are selectively removed.
 4. The multilayersuspension as claimed in claim 1, wherein, in said bending section, atleast one via hole is formed.
 5. The multilayer suspension as claimed inclaim 1, wherein, in said rigid section, at least, said first metalthin-plate layer, said first resin layer and said second metalthin-plate layer are remained.
 6. The multilayer suspension as claimedin claim 1, wherein, in said rigid section, at least one via hole isformed.
 7. The multilayer suspension as claimed in claim 1, wherein, insaid gimbal section, said first metal thin-plate layer and said firstresin layer are selectively removed.
 8. The multilayer suspension asclaimed in claim 1, wherein, in said gimbal section, a gimbal via holeis formed in the center.
 9. The multilayer suspension as claimed inclaim 8, wherein said first metal thin-plate layer has a dimple passingthrough said gimbal via hole, for directly depressing a rear surface ofthe head slider to be mounted on said gimbal section.
 10. The multilayersuspension as claimed in claim 1, wherein said conductive layercomprises patterned trace conductors and patterned connection pads. 11.The multilayer suspension as claimed in claim 1, wherein said first andsecond metal thin-plate layers are formed by stainless steel thinplates.
 12. The multilayer suspension as claimed in claim 1, whereinsaid first and second resin layers are formed by polyimide resin layers.13. The multilayer suspension as claimed in claim 1, wherein saidconductive layer is formed by a copper layer.
 14. A head gimbal assemblyincluding a multilayer suspension and a head slider mounted on saidmultilayer suspension, said head slider having at least one headelement, said multilayer suspension comprising: a resilient bendingsection formed by partially removing at least part of layers of afive-layer structure which includes a first metal thin-plate layer, afirst resin layer laminated on said first metal thin-plate layer, asecond metal thin-plate layer laminated on said first resin layer, asecond resin layer laminated on said second metal thin-plate layer, anda conductive layer laminated on said second resin layer; a resilientgimbal section for mounting said head slider, formed by partiallyremoving at least part of layers of said five-layer structure; and arigid section for coupling said bending section and said gimbal section,formed by partially removing at least part of layers of said five-layerstructure.
 15. The head gimbal assembly as claimed in claim 14, wherein,in said bending section, at least said first metal thin-plate layer isselectively removed.
 16. The head gimbal assembly as claimed in claim14, wherein, in said bending section, said first metal thin-plate layerand said first resin layer are selectively removed.
 17. The head gimbalassembly as claimed in claim 14, wherein, in said bending section, atleast one via hole is formed.
 18. The head gimbal assembly as claimed inclaim 14, wherein, in said rigid section, at least, said first metalthin-plate layer, said first resin layer and said second metalthin-plate layer are remained.
 19. The head gimbal assembly as claimedin claim 18, wherein, in said rigid section, said first resin layer hasa thickness to form a damper structure.
 20. The head gimbal assembly asclaimed in claim 14, wherein, in said rigid section, at least one viahole is formed.
 21. The head gimbal assembly as claimed in claim 14,wherein, in said gimbal section, said first metal thin-plate layer andsaid first resin layer are selectively removed.
 22. The head gimbalassembly as claimed in claim 14, wherein, in said gimbal section, agimbal via hole is formed in the center.
 23. The head gimbal assembly asclaimed in claim 22, wherein said first metal thin-plate layer has adimple passing through said gimbal via hole, for directly depressing arear surface of the head slider to be mounted on said gimbal section.24. The head gimbal assembly as claimed in claim 14, wherein saidconductive layer comprises patterned trace conductors and patternedconnection pads.
 25. The head gimbal assembly as claimed in claim 14,wherein said first and second metal thin-plate layers are formed bystainless steel thin plates.
 26. The head gimbal assembly as claimed inclaim 14, wherein said first and second resin layers are formed bypolyimide resin layers.
 27. The head gimbal assembly as claimed in claim14, wherein said conductive layer is formed by a copper layer.
 28. Amanufacturing method of a head gimbal assembly, comprising the steps of:preparing a five-layer sheet which includes a first metal thin-platelayer, a first resin layer laminated on said first metal thin-platelayer, a second metal thin-plate layer laminated on said first resinlayer, a second resin layer laminated on said second metal thin-platelayer, and a conductive layer laminated on said second resin layer;forming a multilayer suspension by partially removing at least part oflayers of said five-layer sheet, said multilayer suspension comprising aresilient bending section, a resilient gimbal section for mounting ahead slider and a rigid section for coupling said bending section andsaid gimbal section; and fixing the head slider having at least one headelement on said gimbal section of said multilayer suspension.
 29. Themanufacturing method as claimed in claim 28, wherein said forming stepcomprises selectively etching and removing, in said bending section, atleast said first metal thin-plate layer.
 30. The manufacturing method asclaimed in claim 28, wherein said forming step comprises selectivelyetching and removing, in said bending section, said first metalthin-plate layer and said first resin layer, respectively.
 31. Themanufacturing method as claimed in claim 28, wherein said forming stepcomprises forming, in said bending section, at least one via hole byetching.
 32. The manufacturing method as claimed in claim 28, whereinsaid forming step comprises remaining, in said rigid section, at least,said first metal thin-plate layer, said first resin layer and saidsecond metal thin-plate layer.
 33. The manufacturing method as claimedin claim 28, wherein said forming step comprises forming, in said rigidsection, at least one via hole by etching.
 34. The manufacturing methodas claimed in claim 28, wherein said forming step comprises selectivelyetching and removing, in said gimbal section, said first metalthin-plate layer and said first resin layer, respectively.
 35. Themanufacturing method as claimed in claim 28, wherein said forming stepcomprises forming, in said gimbal section, a gimbal via hole in thecenter by etching.
 36. The manufacturing method as claimed in claim 35,wherein said forming step comprises forming a dimple passing throughsaid gimbal via hole, for directly depressing a rear surface of saidhead slider by stamping said first metal thin-plate layer.
 37. Themanufacturing method as claimed in claim 28, wherein said forming stepcomprises forming trace conductors and connection pads by patterningsaid conductive layer.
 38. The manufacturing method as claimed in claim28, wherein said first and second metal thin-plate layers are formed bystainless steel thin plates.
 39. The manufacturing method as claimed inclaim 28, wherein said first and second resin layers are formed bypolyimide resin layers.
 40. The manufacturing method as claimed in claim28, wherein said conductive layer is formed by a copper layer.
 41. Themanufacturing method as claimed in claim 28, wherein said forming stepcomprises forming a multilayer suspension by partially removing at leastpart of layers of said five-layer sheet by selective etching.